据台媒报道,台光电(EMC)董事长丁渝东表示,AI建设将使高端CCL(覆铜板)景气延续到2030年,公司正在台湾、马来西亚和中国大陆扩产以满足需求,并可能视需求和美国政策扩建美国工厂。他认为PTFE因成本、旧工艺和供应链等问题不构成对高端CCL的威胁,目前只有一家厂商在推动PTFE,台光电等采取观望态度。EMC的M10材料将于2026年底推出,M11于2028年推出。
AI 生成摘要 · 以原文为准
The AI build-out will keep the boom in high-end CCL (Copper Clad Laminate) going to 2030 said Elite Material (EMC) Chairman Ding Yu Dong, media report, adding EMC is expanding capacity in Taiwan, Malaysia and China to meet demand. EMC may expand its US plant depending on demand and US policy. He also does not see PTFE as a threat to high-end CCL due to cost, legacy process issues, supply chain dynamics and more, and said only one player is pushing PTFE now while Elite and others are taking a wait-and-see approach. EMC’s M10 material (CCL) will launch at end 2026, and M11 in 2028. https://money.udn.com/money/story/5612/9825897?dark_mode=1
来源:Dan Nystedt · x.com