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Dan Nystedt· @dnystedt · X·· 14 天前AI 评分68
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欣兴电子董事长简尚杰表示,由于材料和生产设备短缺,基板缺货将延续到 2027 年。设备交期显著拉长,超 80% 的设备交期延长,部分设备需 30 个月交付;ABF、T-glass、CCL 等材料短缺已持续近两年。基板是先进半导体封装的关键部件。

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Substrate shortages will remain in 2027 due to shortages of materials and production machinery, said Unimicron Chairman Shan-Chieh Chien, media report. Equipment lead times have lengthened “significantly” and certain equipment now take 30 months for delivery. Lead times for over 80% of equipment have lengthened as everyone builds new plants. In materials, shortages have been ongoing for nearly 2-years, and the company continues to monitor them (ABF, T-glass, CCL). Substrates are a key component for advanced semiconductor packaging. $TSM $ASX $AMKR #semiconductors https://money.udn.com/money/story/5612/9825666?dark_mode=1

来源:Dan Nystedt · x.com