Ben Bajarin· @BenBajarin · X·· 15 天前AI 评分36
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播客已上线！ 本期与 @benbajarin 和 @jaygoldberg 聊半导体资本设备与晶圆设备迈向 3000 亿美元以上市场规模、TSMC 财报、N5 转产 N3 与成熟制程设备短缺、HBM 混合键合、OCP 现场见闻（光背板与液冷）、台达 3MW 冷却器、800V DC 数据中心供电、铜 vs 光互连之争，以及 NVIDIA Rubin Ultra 与 CPO 时间表。
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Pod is up!
WFE to the Moon (Still), Semicon West and OCP Insights With @benbajarin and @jaygoldberg (00:00) Intro: Semicon West & OCP Summit Double-Event Week (01:02) Semicap & Wafer Equipment: Gearing Up for the $300B+ TAM (07:33) Larger Reticle Sizes & Tesla's TeraFab Tool Orders (09:50) Applied Materials' EPIC Center Grand Opening (11:05) TSMC Earnings: Conducting Data Center Physical Site Inspections (14:30) Converting N5 Fabs to N3 & Trailing-Edge Tool Shortages (18:26) Hybrid Bonding for HBM Stacks: Semicap vs. Customer Views (22:27) Anecdote: Door-to-Door Data Center Evangelism in San Diego (26:00) OCP Floor Recaps: Standards, Optical Backplanes & Liquid Cooling (33:55) The Delta Electronics 3MW Cooler & Managing Concurrent Tech Transitions (36:58) 800V DC Data Center Power & Analog Design Wins (43:35) The Copper vs. Optical Debate: The Classic Mustang vs. Ferrari Metaphor (47:46) Multi-Rack Scale-Up Domains: Extending Copper's Life North-to-South (52:16) NVIDIA's Rubin Ultra & Co-Packaged Optics Timelines在 X 查看被引用的帖子
来源：Ben Bajarin · x.com