SemiAnalysis· @SemiAnalysis_ · X·· 3 小时前AI 评分65
AI 导读
SemiAnalysis 称光模块 mSAP PCB（改良型半加成工艺印制电路板）交期已接近六个月，按其统计板卡供应缺口在高个位数百分比。其判断缺的不是电镀产线，而是能通过约三十余项资格认证清单的板卡，该清单主要是公差要求。
AI 生成摘要 · 以原文为准
正文
Optical module mSAP PCB lead times are out near six months and by our count the boards are undersupplied by high single digits. Nobody is short of plating lines. They're short of boards that clear a 3-dozen qual list, and that list is mostly tolerances. (1/4)🧵
来源：SemiAnalysis · x.com