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SemiAnalysis· @SemiAnalysis_ · X·· 20 天前AI 评分61
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SemiAnalysis 基于其 Foundry Model 指出,从 2Q22 到 2Q26,TSMC 的晶圆收入份额大幅扩张,而出货份额大体持平,与 UMC、GlobalFoundries 和 Samsung 的混合 ASP 差距持续扩大。TSMC 混合 ASP 创新高,多数同业仍低于此前峰值;向更高价值节点迁移使收入增长快于晶圆出货量,技术领先转化为更高的单晶圆收入。

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TSMC’s wafer ASP gap with UMC, GlobalFoundries and Samsung keeps widening. TSMC is setting new blended ASP highs while most peers remain below their previous peaks. Per our Foundry Model, from 2Q22 to 2Q26, TSMC’s wafer revenue share expanded sharply while its shipment share remained broadly stable, widening its blended ASP premium. Migration toward higher-value nodes increases TSMC’s blended ASP, allowing revenue to grow faster than wafer shipments. Technology leadership is translating into more revenue per wafer.

来源:SemiAnalysis · x.com