Dan Nystedt· @dnystedt · X·· 23 天前AI 评分48
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芯片外交：媒体报道，台湾与斯洛伐克签署一项半导体协议，瞄准车用（含电动车）芯片、芯片封装与模组整合，并称台湾将提供技术转移、专业知识、研发基础设施与培训，帮助斯洛伐克建设其半导体产业。 #Slovakia #Taiwan #semiconductors https://www.cna.com.tw/news/aopl/202610100175.aspx
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正文
Chip Diplomacy: Taiwan and Slovakia signed a semiconductor deal targeting automotive (including EV) chips, chip packaging and module integration, media report, adding Taiwan is providing technology transfer, expertise, R&D infrastructure and training to help Slovakia build its semiconductor industry. #Slovakia #Taiwan #semiconductors https://www.cna.com.tw/news/aopl/202610100175.aspx
来源：Dan Nystedt · x.com