Dan Nystedt· @dnystedt · X·· 2 天前AI 评分44
AI 导读
据媒体报道，三星会长李在镕周日（11/1）首次访问公司位于日本横滨的先进半导体封装研发实验室。该实验室于9月启用，旨在通过与日本材料、零部件和设备供应商更紧密合作，提升三星的 AI 芯片封装实力。三星计划继续为该实验室招聘当地研究人员。#Samsung #semiconductors https://jp.yna.co.kr/view/AJP20261101000800882
AI 生成摘要 · 以原文为准
正文
Samsung Chairman Lee Jae-yong made his first visit to the company's advanced semiconductor packaging R&D lab in Yokohama, Japan on Sunday (11/1), media report, adding the lab, which opened in September, is aimed at boosting Samsung’s AI chip packaging prowess by working more closely with Japanese suppliers of materials, parts and equipment. Samsung plans to continue hiring local researchers for the lab. #Samsung #semiconductors https://jp.yna.co.kr/view/AJP20261101000800882
来源：Dan Nystedt · x.com