Dan Nystedt· @dnystedt · X·· 22 天前AI 评分67
AI 导读
据媒体报道，微软自研的 Maia 200 AI 芯片目前已在生产，下一代 Maia 300 将于明年开始制造，其计算芯粒（Chiplet）将由 TSMC 采用 2nm 工艺（N2）制造。微软计划在内部 AI 数据中心部署数吉瓦（GW）规模的 Maia 算力。
AI 生成摘要 · 以原文为准
正文
Microsoft’s self-developed Maia 200 AI chips are in production now and the manufacture of its next-generation Maia 300 will begin next year, media report, adding Maia 300’s compute tiles (chiplets) will be manufactured by TSMC on its 2nm process (N2). Microsoft plans to deploy several GigaWatts (GW) of Maia processing power for use in its internal AI data centers. $MSFT $TSM https://www.cna.com.tw/news/ait/202610120307.aspx
来源：Dan Nystedt · x.com