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Dan Nystedt· @dnystedt · X·· 16 天前AI 评分68
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据媒体报道,三星已接受英伟达要求,为其定制 HBM 产品 NVHBM(基于下一代 HBM4E)改由 TSMC 代工基底裸片。三星由此加入 SK hynix 和 Micron 行列,统一使用 TSMC 3nm 基底裸片以保证性能一致并减少跨供应商验证工作。

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Samsung has accepted Nvidia’s request to have TSMC manufacture the base die for NVHBM (Nvidia’s custom HBM based on next-gen HBM4E), a concession to the world’s biggest HBM buyer, media report. Samsung joins SK Hynix and Micron in using TSMC’s 3nm base die to ensure consistent performance and reduce validation work across suppliers.

Among the three big memory chip makers, only Samsung has historically supplied its own base die for HBM and will continue to do so for standard products and other clients. It is also validating whether it can supply its own version of the NVHBM base die in case demand exceeds TSMC’s capacity. $NVDA $TSM $SKHY $MU $SSNLF #Samsung #semiconductors https://en.sedaily.com/finance/2026/10/18/samsung-to-use-tsmc-for-base-die-in-nvidias-custom-hbm

来源:Dan Nystedt · x.com