Dan Nystedt· @dnystedt · X·· 15 天前AI 评分43
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DigiTimes 传闻称,Google 下一代 AI 芯片 TPU v9 因先进封装所用玻璃基板良率偏低,可能面临延期。该 Google 与联发科合作项目原计划 2027 年底量产、2028 年规模出货。据报道双方正在调整设计以解决封装端问题。
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正文
Rumor: Google’s next-gen AI silicon, the TPU v9, may face delays due to low yields on glass substrates used in advanced packaging, DigiTimes reports. The Google–MediaTek project was originally slated for mass production in late 2027 and volume shipments in 2028. This rumor is the latest sign of trouble on the advanced packaging side, with the companies reportedly making design adjustments to resolve the issue. $GOOGL $INTC $TSM #mediatek #semiconductors https://www.digitimes.com.tw/tech/dt/n/shwnws.asp?CnlID=1&Cat=40&id=0000771936_S1EL12IA2J94BA7U44MUF
来源:Dan Nystedt · x.com