SemiAnalysis· @SemiAnalysis_ · X·· 4 天前AI 评分38
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今年的 Semicon West 上，混合键合引发大量关注。EV Group 将混合键合作为一种加速 3D 集成和先进封装的重要技术进行展示。他们介绍了实现 die-to-wafer 混合键合的两种主要方法：直接放置（direct placement）和集体 die-to-wafer 键合。(1/2)🧵
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In Semicon west this year, there was a lot of buzz around hybrid bonding. EV group presented hybrid bonding as an important technique accelerating 3D integration and advanced packaging. They presented two major methods to perform die-to-wafer hybrid bonding which are direct placement and collective die-to-wafer. (1/2)🧵
来源：SemiAnalysis · x.com