媒体报道三星 Project Kairos 计划在韩国器兴园区新建 2nm/4nm 晶圆厂,估算成本约 192.3 亿美元,将该园区改造为先进晶圆代工与封装枢纽。项目分四期建设晶圆厂,并含公用设施大楼和变电站,主要用于生产 HBM4/HBM4E 的逻辑 base die,其中 2nm 面向 HBM5。
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Samsung's 'Project Kairos' plans a new 2nm/4nm fab at its Giheung, South Korea campus, the birthplace of its memory chip business, at an estimated cost of about US$19.23 billion, media report, turning the site into an advanced foundry and packaging hub.
Named after the Greek god of opportunity, Kairos includes a 4-phase fab, a utility building and a substation, and will mainly make logic base dies for HBM4/HBM4E, with 2nm aimed at HBM5. EUV tools could cost $6.15–7.69 billion; with other equipment and cleanroom work the total tops $15.38 billion, and could reach $23.08 billion including converting Line 6 to advanced packaging. $ASML $AMAT $TOELY $LRCX $KLAC #Samsung #semiconductors https://www.businesskorea.co.kr/news/articleView.html?idxno=280495
来源:Dan Nystedt · x.com