三星电子在第三季度业绩会上将 2026 年半导体 CapEx 计划上调至 76.8 万亿韩元（约 530 亿美元），上一年为 47.5 万亿韩元（334 亿美元），前三季度已投入 52.8 万亿韩元。高管称 AI 相关需求预计将持续多年，2027 年 CapEx 还将进一步上升，并计划在美国和韩国新建晶圆厂和先进封装厂；Taylor, Texas 工厂资本开支将增加，正在评估新建厂房。
AI 生成摘要 · 以原文为准
三星把 2026 年半导体 CapEx 计划上调至 76.8 万亿韩元，并计划在美韩新建晶圆厂和先进封装厂，可据此跟踪 AI 相关产能扩张节奏。
Samsung Electronics raised its 2026 semiconductor capex plan to ₩76.8 trillion won (US$53 billion), from ₩47.5 trillion last year ($33.4 billion) amid strong AI-related demand expected to continue for years, executives said during its 3rd quarter conference. ₩52.8T has already been spent thru Q3.
-2027 capex to rise further versus 2026
-New fabs and advanced packaging plants are being planned for the US and Korea to meet strong AI demand
Taylor, Texas site capex set to rise – new fab building under review
-Taylor fab to start operations in 2027
-Equipment move-in going on now $ASML $AMAT $LRCX $KLAC $TOELY #Texas #Taylor #Semiconductors
来源：Dan Nystedt · x.com